IC Package Market Report

China IC Package Industry Market Research Report 2023-2029

  • POSTDATE：Aug 22, 2023
  • PAGES：178
  • REPORT CODE：GMM1750005
  • REPORT SUMMARY
  • TABLE OF CONTENTS

  • This report elaborates on the current development of the IC Package industry thoroughly based on the international market dynamics and China's market situation.

    For a start, the report provides an in-depth analysis of the current market situation through three different aspects - by region, by type and by application, which includes market distribution of different types and applications, import and export analysis of major regions, development trends of different types of products in each region, market opportunities and market restrains of different applications.

    Secondly, this report lists the major players in the industry, displaying their market positions and strengths and weaknesses of their products, picturing the current competitive situation of the whole market. 

    Last but not least, the report analyzes and predicts the investment prospects and risks in the industry on the basis of industry data, combined with experts' opinions and suggestions.

    By Player:

    • UTAC

    • Chipbond

    • JECT

    • J-devices

    • Powertech Technology

    • Amkor

    • ASE

    • STATS ChipPac

    • ChipMOS

    By Type:

    • DFN

    • Other

    • WLP

    • QFN

    By Application:

    • Driver IC

    • CMOS Image Sensors

    • Integrated Passive Devices (IPD)

    • Accelerometer/Gyro Sensors

    • RF Devices (Including RF Filters)

    • Magnetic Sensors

    By Research Region:

    • North China

    • Central China

    • South China

    • East China

    • Northeast China

    • Southwest China

    • Northwest China

  • TABLE OF CONTENT

    Chapter 1 China IC Package Market Overview 2018-2029

    • 1.1 China IC Package Industry Development Overview

    • 1.2 China IC Package Industry Development History

    • 1.3 China IC Package Industry Market Size (2018-2029)

    • 1.4 China IC Package Market Analysis by Type from Production Side

      • 1.4.1 China IC Package Production Volume, Production Value and Growth Rate of DFN (2018-2029)

      • 1.4.2 China IC Package Production Volume, Production Value and Growth Rate of Other (2018-2029)

      • 1.4.3 China IC Package Production Volume, Production Value and Growth Rate of WLP (2018-2029)

      • 1.4.4 China IC Package Production Volume, Production Value and Growth Rate of QFN (2018-2029)

    • 1.5 China IC Package Market Analysis by Application from Consumption End

      • 1.5.1 China IC Package Sales Volume, Sales Value and Growth Rate of Driver IC (2018-2029)

      • 1.5.2 China IC Package Sales Volume, Sales Value and Growth Rate of CMOS Image Sensors (2018-2029)

      • 1.5.3 China IC Package Sales Volume, Sales Value and Growth Rate of Integrated Passive Devices (IPD) (2018-2029)

      • 1.5.4 China IC Package Sales Volume, Sales Value and Growth Rate of Accelerometer/Gyro Sensors (2018-2029)

      • 1.5.5 China IC Package Sales Volume, Sales Value and Growth Rate of RF Devices (Including RF Filters) (2018-2029)

      • 1.5.6 China IC Package Sales Volume, Sales Value and Growth Rate of Magnetic Sensors (2018-2029)

    • 1.6 China IC Package Market Analysis by Region

      • 1.6.1 North China IC Package Market Size and Growth Rate from 2018-2029

      • 1.6.2 Central China IC Package Market Size and Growth Rate from 2018-2029

      • 1.6.3 South China IC Package Market Size and Growth Rate from 2018-2029

      • 1.6.4 East China IC Package Market Size and Growth Rate from 2018-2029

      • 1.6.5 Northeast China IC Package Market Size and Growth Rate from 2018-2029

      • 1.6.6 Southwest China IC Package Market Size and Growth Rate from 2018-2029

      • 1.6.7 Northwest China IC Package Market Size and Growth Rate from 2018-2029

    Chapter 2 China IC Package Industry Development Environment

    • 2.1 Industry Development Environment Analysis

      • 2.1.1 Industry Technological Progress Analysis

      • 2.1.2 Industrial Organizational Innovation Analysis

      • 2.1.3 Changes in Social Habits

      • 2.1.4 Alterations in Government Policies

      • 2.1.5 Impact of Economic Globalization

    • 2.2 Domestic and Foreign Industry Competition Analysis

      • 2.2.1 Comparative Analysis on IC Package Market Status and Competition at home and abroad in 2023

      • 2.2.2 China IC Package Market Status and Competition Analysis in 2023

      • 2.2.3 China IC Package Market Concentration Analysis in 2023

    • 2.3 Problems and Countermeasures in the development of China IC Package Industry

      • 2.3.1 Industry Development Constraints

      • 2.3.2 Industry Development Considerations

      • 2.3.3 Suggestions on Industry Development Measures

      • 2.3.4 Development Strategies for SMEs

    • 2.4 Influence of COVID-19 Outbreak on IC Package Industry Development

    Chapter 3 IC PackageIndustry Chain Analysis

    • 3.1 IC Package Industry Chain

    • 3.2 IC Package Upstream Industry Analysis

      • 3.2.1 Upstream Industry Development Status

      • 3.2.2 Upstream Industry Development Forecast

      • 3.2.3 Impact of Upstream Industry on the IC Package Market

    • 3.3 IC Package Downstream Industry Analysis

      • 3.3.1 Downstream Industry Development Status

      • 3.3.2 Downstream Industry Development Forecast

      • 3.3.3 Impact of Downstream Industry on the IC Package Market

    Chapter 4 China IC Package Market, by Type

    • 4.1 China IC Package Market Trend, by Type

    • 4.2 Product Types of Major Suppliers

    • 4.3 Competitive Landscape of Major Types

    • 4.4 China IC Package Total Production Volume and Growth Rate from Production Side

    • 4.5 China IC Package Production Volume and Growth Rate, by Type

      • 4.5.1 China IC Package Production Volume and Growth Rate of DFN

      • 4.5.2 China IC Package Production Volume and Growth Rate of Other

      • 4.5.3 China IC Package Production Volume and Growth Rate of WLP

      • 4.5.4 China IC Package Production Volume and Growth Rate of QFN

    Chapter 5 China IC Package Market, by Application

    • 5.1 Downstream Market Overview

    • 5.2 Competitive Landscape of Major Applications

    • 5.3 Market Potential Analysis, by Application

    • 5.4 China IC Package Total Market Size and Growth Rate from Consumption End

    • 5.5 China IC Package Market Size and Growth Rate, by Application

      • 5.5.1 China IC Package Market Size and Growth Rate of Driver IC

      • 5.5.2 China IC Package Market Size and Growth Rate of CMOS Image Sensors

      • 5.5.3 China IC Package Market Size and Growth Rate of Integrated Passive Devices (IPD)

      • 5.5.4 China IC Package Market Size and Growth Rate of Accelerometer/Gyro Sensors

      • 5.5.5 China IC Package Market Size and Growth Rate of RF Devices (Including RF Filters)

      • 5.5.6 China IC Package Market Size and Growth Rate of Magnetic Sensors

    Chapter 6 China IC Package Market, by Region

    • 6.1 China IC Package Production Volume and Production Value, by Region

    • 6.2 China IC Package Sales Volume and Sales Value, by Region

    Chapter 7 North China IC Package Market Analysis

    • 7.1 North China IC Package Market, by Type

    • 7.2 North China IC Package Market, by Application

    Chapter 8 Central China IC Package Market Analysis

    • 8.1 Central China IC Package Market, by Type

    • 8.2 Central China IC Package Market, by Application

    Chapter 9 South China IC Package Market Analysis

    • 9.1 South China IC Package Market, by Type

    • 9.2 South China IC Package Market, by Application

    Chapter 10 East China IC Package Market Analysis

    • 10.1 East China IC Package Market, by Type

    • 10.2 East China IC Package Market, by Application

    Chapter 11 Northeast China IC Package Market Analysis

    • 11.1 Northeast China IC Package Market, by Type

    • 11.2 Northeast China IC Package Market, by Application

    Chapter 12 Southwest China IC Package Market Analysis

    • 12.1 Southwest China IC Package Market, by Type

    • 12.2 Southwest China IC Package Market, by Application

    Chapter 13 Northwest China IC Package Market Analysis

    • 13.1 Northwest China IC Package Market, by Type

    • 13.2 Northwest China IC Package Market, by Application

    Chapter 14 Company Profiles

      • 14.1 UTAC

        • 14.1.1 UTAC Company Profile

        • 14.1.2 UTAC IC Package Market Performance

        • 14.1.3 Product&Service Introduction

      • 14.2 Chipbond

        • 14.2.1 Chipbond Company Profile

        • 14.2.2 Chipbond IC Package Market Performance

        • 14.2.3 Product&Service Introduction

      • 14.3 JECT

        • 14.3.1 JECT Company Profile

        • 14.3.2 JECT IC Package Market Performance

        • 14.3.3 Product&Service Introduction

      • 14.4 J-devices

        • 14.4.1 J-devices Company Profile

        • 14.4.2 J-devices IC Package Market Performance

        • 14.4.3 Product&Service Introduction

      • 14.5 Powertech Technology

        • 14.5.1 Powertech Technology Company Profile

        • 14.5.2 Powertech Technology IC Package Market Performance

        • 14.5.3 Product&Service Introduction

      • 14.6 Amkor

        • 14.6.1 Amkor Company Profile

        • 14.6.2 Amkor IC Package Market Performance

        • 14.6.3 Product&Service Introduction

      • 14.7 ASE

        • 14.7.1 ASE Company Profile

        • 14.7.2 ASE IC Package Market Performance

        • 14.7.3 Product&Service Introduction

      • 14.8 STATS ChipPac

        • 14.8.1 STATS ChipPac Company Profile

        • 14.8.2 STATS ChipPac IC Package Market Performance

        • 14.8.3 Product&Service Introduction

      • 14.9 ChipMOS

        • 14.9.1 ChipMOS Company Profile

        • 14.9.2 ChipMOS IC Package Market Performance

        • 14.9.3 Product&Service Introduction

    Chapter 15 Research Conclusions and Investment Suggestions

    • 15.1 IC Package Industry Research Conclusions

    • 15.2 IC Package Industry Investment Suggestions

      • 15.2.1 Suggestions on Industry Development Strategy

      • 15.2.2 Suggestions on Industry Investment Direction

      • 15.2.3 Suggestions on Industry Investment Strategy


    List of Tables and Figures

    • Figure China IC Package Industry Market Size (2018-2029)

    • Figure China IC Package Production Volume, Production Value and Growth Rate of DFN (2018-2029)

    • Figure China IC Package Production Volume, Production Value and Growth Rate of Other (2018-2029)

    • Figure China IC Package Production Volume, Production Value and Growth Rate of WLP (2018-2029)

    • Figure China IC Package Production Volume, Production Value and Growth Rate of QFN (2018-2029)

    • Figure China IC Package Sales Volume, Sales Value and Growth Rate of Driver IC (2018-2029)

    • Figure China IC Package Sales Volume, Sales Value and Growth Rate of CMOS Image Sensors (2018-2029)

    • Figure China IC Package Sales Volume, Sales Value and Growth Rate of Integrated Passive Devices (IPD) (2018-2029)

    • Figure China IC Package Sales Volume, Sales Value and Growth Rate of Accelerometer/Gyro Sensors (2018-2029)

    • Figure China IC Package Sales Volume, Sales Value and Growth Rate of RF Devices (Including RF Filters) (2018-2029)

    • Figure China IC Package Sales Volume, Sales Value and Growth Rate of Magnetic Sensors (2018-2029)

    • Figure North China IC Package Market Size and Growth Rate from 2018-2029

    • Figure Central China IC Package Market Size and Growth Rate from 2018-2029

    • Figure South China IC Package Market Size and Growth Rate from 2018-2029

    • Figure East China IC Package Market Size and Growth Rate from 2018-2029

    • Figure Northeast China IC Package Market Size and Growth Rate from 2018-2029

    • Figure Southwest China IC Package Market Size and Growth Rate from 2018-2029

    • Figure Northwest China IC Package Market Size and Growth Rate from 2018-2029

    • Figure IC Package Industry Chain

    • Table Product Types of Major Suppliers in 2023

    • Figure China IC Package Market Share by Type in 2018

    • Figure China IC Package Market Share by Type in 2023

    • Figure China IC Package Total Production Volume and Growth Rate from Production Side (2018-2023)

    • Figure China IC Package Production Volume and Growth Rate of DFN (2018-2023)

    • Figure China IC Package Production Volume and Growth Rate of Other (2018-2023)

    • Figure China IC Package Production Volume and Growth Rate of WLP (2018-2023)

    • Figure China IC Package Production Volume and Growth Rate of QFN (2018-2023)

    • Figure China IC Package Market Share by Application in 2018

    • Figure China IC Package Market Share by Application in 2023

    • Figure China IC Package Total Market Size and Growth Rate from Consumption End

    • Figure China IC Package Market Size and Growth Rate of Driver IC (2018-2023)

    • Figure China IC Package Market Size and Growth Rate of CMOS Image Sensors (2018-2023)

    • Figure China IC Package Market Size and Growth Rate of Integrated Passive Devices (IPD) (2018-2023)

    • Figure China IC Package Market Size and Growth Rate of Accelerometer/Gyro Sensors (2018-2023)

    • Figure China IC Package Market Size and Growth Rate of RF Devices (Including RF Filters) (2018-2023)

    • Figure China IC Package Market Size and Growth Rate of Magnetic Sensors (2018-2023)

    • Table China IC Package Production Volume by Region (2018-2023)

    • Table China IC Package Production Volume Share by Region (2018-2023)

    • Figure China IC Package Production Volume Share by Region (2018-2023)

    • Table China IC Package Production Value by Region (2018-2023)

    • Table China IC Package Production Value Share by Region (2018-2023)

    • Figure China IC Package Production Value Share by Region (2018-2023)

    • Table China IC Package Sales Volume by Region (2018-2023)

    • Table China IC Package Sales Volume Share by Region (2018-2023)

    • Figure China IC Package Sales Volume Share by Region (2018-2023)

    • Table China IC Package Sales Value by Region (2018-2023)

    • Table China IC Package Sales Value Share by Region (2018-2023)

    • Figure China IC Package Sales Value Share by Region (2018-2023)

    • Table North China IC Package Production Volume by Type (2018-2023)

    • Table North China IC Package Production Volume Share by Type (2018-2023)

    • Figure North China IC Package Production Volume Share by Type (2018-2023)

    • Table North China IC Package Sales Volume by Application (2018-2023)

    • Table North China IC Package Sales Volume Share by Application (2018-2023)

    • Figure North China IC Package Sales Volume Share by Application (2018-2023)

    • Table Central China IC Package Production Volume by Type (2018-2023)

    • Table Central China IC Package Production Volume Share by Type (2018-2023)

    • Figure Central China IC Package Production Volume Share by Type (2018-2023)

    • Table Central China IC Package Sales Volume by Application (2018-2023)

    • Table Central China IC Package Sales Volume Share by Application (2018-2023)

    • Figure Central China IC Package Sales Volume Share by Application (2018-2023)

    • Table South China IC Package Production Volume by Type (2018-2023)

    • Table South China IC Package Production Volume Share by Type (2018-2023)

    • Figure South China IC Package Production Volume Share by Type (2018-2023)

    • Table South China IC Package Sales Volume by Application (2018-2023)

    • Table South China IC Package Sales Volume Share by Application (2018-2023)

    • Figure South China IC Package Sales Volume Share by Application (2018-2023)

    • Table East China IC Package Production Volume by Type (2018-2023)

    • Table East China IC Package Production Volume Share by Type (2018-2023)

    • Figure East China IC Package Production Volume Share by Type (2018-2023)

    • Table East China IC Package Sales Volume by Application (2018-2023)

    • Table East China IC Package Sales Volume Share by Application (2018-2023)

    • Figure East China IC Package Sales Volume Share by Application (2018-2023)

    • Table Northeast China IC Package Production Volume by Type (2018-2023)

    • Table Northeast China IC Package Production Volume Share by Type (2018-2023)

    • Figure Northeast China IC Package Production Volume Share by Type (2018-2023)

    • Table Northeast China IC Package Sales Volume by Application (2018-2023)

    • Table Northeast China IC Package Sales Volume Share by Application (2018-2023)

    • Figure Northeast China IC Package Sales Volume Share by Application (2018-2023)

    • Table Southwest China IC Package Production Volume by Type (2018-2023)

    • Table Southwest China IC Package Production Volume Share by Type (2018-2023)

    • Figure Southwest China IC Package Production Volume Share by Type (2018-2023)

    • Table Southwest China IC Package Sales Volume by Application (2018-2023)

    • Table Southwest China IC Package Sales Volume Share by Application (2018-2023)

    • Figure Southwest China IC Package Sales Volume Share by Application (2018-2023)

    • Table Northwest China IC Package Production Volume by Type (2018-2023)

    • Table Northwest China IC Package Production Volume Share by Type (2018-2023)

    • Figure Northwest China IC Package Production Volume Share by Type (2018-2023)

    • Table Northwest China IC Package Sales Volume by Application (2018-2023)

    • Table Northwest China IC Package Sales Volume Share by Application (2018-2023)

    • Figure Northwest China IC Package Sales Volume Share by Application (2018-2023)

    • Table UTAC Company Profile

    • Table UTAC IC Package Revenue, Price and Gross (2018-2023)

    • Table Chipbond Company Profile

    • Table Chipbond IC Package Revenue, Price and Gross (2018-2023)

    • Table JECT Company Profile

    • Table JECT IC Package Revenue, Price and Gross (2018-2023)

    • Table J-devices Company Profile

    • Table J-devices IC Package Revenue, Price and Gross (2018-2023)

    • Table Powertech Technology Company Profile

    • Table Powertech Technology IC Package Revenue, Price and Gross (2018-2023)

    • Table Amkor Company Profile

    • Table Amkor IC Package Revenue, Price and Gross (2018-2023)

    • Table ASE Company Profile

    • Table ASE IC Package Revenue, Price and Gross (2018-2023)

    • Table STATS ChipPac Company Profile

    • Table STATS ChipPac IC Package Revenue, Price and Gross (2018-2023)

    • Table ChipMOS Company Profile

    • Table ChipMOS IC Package Revenue, Price and Gross (2018-2023)


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