Semiconductor Assembly and Packaging Equipment Market Report

China Semiconductor Assembly and Packaging Equipment Industry Market Research Report 2023-2029

  • POSTDATE：Sep 03, 2023
  • PAGES：169
  • REPORT CODE：GMM1774084
  • REPORT SUMMARY
  • TABLE OF CONTENTS

  • Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.

    The increase in application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.

    This report elaborates on the current development of the Semiconductor Assembly and Packaging Equipment industry thoroughly based on the international market dynamics and China's market situation.

    For a start, the report provides an in-depth analysis of the current market situation through three different aspects - by region, by type and by application, which includes market distribution of different types and applications, import and export analysis of major regions, development trends of different types of products in each region, market opportunities and market restrains of different applications.

    Secondly, this report lists the major players in the industry, displaying their market positions and strengths and weaknesses of their products, picturing the current competitive situation of the whole market. 

    Last but not least, the report analyzes and predicts the investment prospects and risks in the industry on the basis of industry data, combined with experts' opinions and suggestions.

    By Player:

    • DIAS Automation

    • Shinkawa

    • Toray Engineering

    • West Bond

    • Hesse Mechatronics

    • Kulicke & Soffa Industries

    • HYBOND

    • Accrutech

    • Palomar Technologies

    By Type:

    • Packaging Equipment

    • Wire Bonders

    • Others

    • Die Bonders

    By Application:

    • IDMs

    • OSAT

    By Research Region:

    • North China

    • Central China

    • South China

    • East China

    • Northeast China

    • Southwest China

    • Northwest China

  • TABLE OF CONTENT

    Chapter 1 China Semiconductor Assembly and Packaging Equipment Market Overview 2018-2029

    • 1.1 China Semiconductor Assembly and Packaging Equipment Industry Development Overview

    • 1.2 China Semiconductor Assembly and Packaging Equipment Industry Development History

    • 1.3 China Semiconductor Assembly and Packaging Equipment Industry Market Size (2018-2029)

    • 1.4 China Semiconductor Assembly and Packaging Equipment Market Analysis by Type from Production Side

      • 1.4.1 China Semiconductor Assembly and Packaging Equipment Production Volume, Production Value and Growth Rate of Packaging Equipment (2018-2029)

      • 1.4.2 China Semiconductor Assembly and Packaging Equipment Production Volume, Production Value and Growth Rate of Wire Bonders (2018-2029)

      • 1.4.3 China Semiconductor Assembly and Packaging Equipment Production Volume, Production Value and Growth Rate of Others (2018-2029)

      • 1.4.4 China Semiconductor Assembly and Packaging Equipment Production Volume, Production Value and Growth Rate of Die Bonders (2018-2029)

    • 1.5 China Semiconductor Assembly and Packaging Equipment Market Analysis by Application from Consumption End

      • 1.5.1 China Semiconductor Assembly and Packaging Equipment Sales Volume, Sales Value and Growth Rate of IDMs (2018-2029)

      • 1.5.2 China Semiconductor Assembly and Packaging Equipment Sales Volume, Sales Value and Growth Rate of OSAT (2018-2029)

    • 1.6 China Semiconductor Assembly and Packaging Equipment Market Analysis by Region

      • 1.6.1 North China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

      • 1.6.2 Central China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

      • 1.6.3 South China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

      • 1.6.4 East China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

      • 1.6.5 Northeast China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

      • 1.6.6 Southwest China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

      • 1.6.7 Northwest China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

    Chapter 2 China Semiconductor Assembly and Packaging Equipment Industry Development Environment

    • 2.1 Industry Development Environment Analysis

      • 2.1.1 Industry Technological Progress Analysis

      • 2.1.2 Industrial Organizational Innovation Analysis

      • 2.1.3 Changes in Social Habits

      • 2.1.4 Alterations in Government Policies

      • 2.1.5 Impact of Economic Globalization

    • 2.2 Domestic and Foreign Industry Competition Analysis

      • 2.2.1 Comparative Analysis on Semiconductor Assembly and Packaging Equipment Market Status and Competition at home and abroad in 2023

      • 2.2.2 China Semiconductor Assembly and Packaging Equipment Market Status and Competition Analysis in 2023

      • 2.2.3 China Semiconductor Assembly and Packaging Equipment Market Concentration Analysis in 2023

    • 2.3 Problems and Countermeasures in the development of China Semiconductor Assembly and Packaging Equipment Industry

      • 2.3.1 Industry Development Constraints

      • 2.3.2 Industry Development Considerations

      • 2.3.3 Suggestions on Industry Development Measures

      • 2.3.4 Development Strategies for SMEs

    • 2.4 Influence of COVID-19 Outbreak on Semiconductor Assembly and Packaging Equipment Industry Development

    Chapter 3 Semiconductor Assembly and Packaging EquipmentIndustry Chain Analysis

    • 3.1 Semiconductor Assembly and Packaging Equipment Industry Chain

    • 3.2 Semiconductor Assembly and Packaging Equipment Upstream Industry Analysis

      • 3.2.1 Upstream Industry Development Status

      • 3.2.2 Upstream Industry Development Forecast

      • 3.2.3 Impact of Upstream Industry on the Semiconductor Assembly and Packaging Equipment Market

    • 3.3 Semiconductor Assembly and Packaging Equipment Downstream Industry Analysis

      • 3.3.1 Downstream Industry Development Status

      • 3.3.2 Downstream Industry Development Forecast

      • 3.3.3 Impact of Downstream Industry on the Semiconductor Assembly and Packaging Equipment Market

    Chapter 4 China Semiconductor Assembly and Packaging Equipment Market, by Type

    • 4.1 China Semiconductor Assembly and Packaging Equipment Market Trend, by Type

    • 4.2 Product Types of Major Suppliers

    • 4.3 Competitive Landscape of Major Types

    • 4.4 China Semiconductor Assembly and Packaging Equipment Total Production Volume and Growth Rate from Production Side

    • 4.5 China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate, by Type

      • 4.5.1 China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate of Packaging Equipment

      • 4.5.2 China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate of Wire Bonders

      • 4.5.3 China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate of Others

      • 4.5.4 China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate of Die Bonders

    Chapter 5 China Semiconductor Assembly and Packaging Equipment Market, by Application

    • 5.1 Downstream Market Overview

    • 5.2 Competitive Landscape of Major Applications

    • 5.3 Market Potential Analysis, by Application

    • 5.4 China Semiconductor Assembly and Packaging Equipment Total Market Size and Growth Rate from Consumption End

    • 5.5 China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate, by Application

      • 5.5.1 China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate of IDMs

      • 5.5.2 China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate of OSAT

    Chapter 6 China Semiconductor Assembly and Packaging Equipment Market, by Region

    • 6.1 China Semiconductor Assembly and Packaging Equipment Production Volume and Production Value, by Region

    • 6.2 China Semiconductor Assembly and Packaging Equipment Sales Volume and Sales Value, by Region

    Chapter 7 North China Semiconductor Assembly and Packaging Equipment Market Analysis

    • 7.1 North China Semiconductor Assembly and Packaging Equipment Market, by Type

    • 7.2 North China Semiconductor Assembly and Packaging Equipment Market, by Application

    Chapter 8 Central China Semiconductor Assembly and Packaging Equipment Market Analysis

    • 8.1 Central China Semiconductor Assembly and Packaging Equipment Market, by Type

    • 8.2 Central China Semiconductor Assembly and Packaging Equipment Market, by Application

    Chapter 9 South China Semiconductor Assembly and Packaging Equipment Market Analysis

    • 9.1 South China Semiconductor Assembly and Packaging Equipment Market, by Type

    • 9.2 South China Semiconductor Assembly and Packaging Equipment Market, by Application

    Chapter 10 East China Semiconductor Assembly and Packaging Equipment Market Analysis

    • 10.1 East China Semiconductor Assembly and Packaging Equipment Market, by Type

    • 10.2 East China Semiconductor Assembly and Packaging Equipment Market, by Application

    Chapter 11 Northeast China Semiconductor Assembly and Packaging Equipment Market Analysis

    • 11.1 Northeast China Semiconductor Assembly and Packaging Equipment Market, by Type

    • 11.2 Northeast China Semiconductor Assembly and Packaging Equipment Market, by Application

    Chapter 12 Southwest China Semiconductor Assembly and Packaging Equipment Market Analysis

    • 12.1 Southwest China Semiconductor Assembly and Packaging Equipment Market, by Type

    • 12.2 Southwest China Semiconductor Assembly and Packaging Equipment Market, by Application

    Chapter 13 Northwest China Semiconductor Assembly and Packaging Equipment Market Analysis

    • 13.1 Northwest China Semiconductor Assembly and Packaging Equipment Market, by Type

    • 13.2 Northwest China Semiconductor Assembly and Packaging Equipment Market, by Application

    Chapter 14 Company Profiles

      • 14.1 DIAS Automation

        • 14.1.1 DIAS Automation Company Profile

        • 14.1.2 DIAS Automation Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.1.3 Product&Service Introduction

      • 14.2 Shinkawa

        • 14.2.1 Shinkawa Company Profile

        • 14.2.2 Shinkawa Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.2.3 Product&Service Introduction

      • 14.3 Toray Engineering

        • 14.3.1 Toray Engineering Company Profile

        • 14.3.2 Toray Engineering Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.3.3 Product&Service Introduction

      • 14.4 West Bond

        • 14.4.1 West Bond Company Profile

        • 14.4.2 West Bond Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.4.3 Product&Service Introduction

      • 14.5 Hesse Mechatronics

        • 14.5.1 Hesse Mechatronics Company Profile

        • 14.5.2 Hesse Mechatronics Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.5.3 Product&Service Introduction

      • 14.6 Kulicke & Soffa Industries

        • 14.6.1 Kulicke & Soffa Industries Company Profile

        • 14.6.2 Kulicke & Soffa Industries Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.6.3 Product&Service Introduction

      • 14.7 HYBOND

        • 14.7.1 HYBOND Company Profile

        • 14.7.2 HYBOND Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.7.3 Product&Service Introduction

      • 14.8 Accrutech

        • 14.8.1 Accrutech Company Profile

        • 14.8.2 Accrutech Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.8.3 Product&Service Introduction

      • 14.9 Palomar Technologies

        • 14.9.1 Palomar Technologies Company Profile

        • 14.9.2 Palomar Technologies Semiconductor Assembly and Packaging Equipment Market Performance

        • 14.9.3 Product&Service Introduction

    Chapter 15 Research Conclusions and Investment Suggestions

    • 15.1 Semiconductor Assembly and Packaging Equipment Industry Research Conclusions

    • 15.2 Semiconductor Assembly and Packaging Equipment Industry Investment Suggestions

      • 15.2.1 Suggestions on Industry Development Strategy

      • 15.2.2 Suggestions on Industry Investment Direction

      • 15.2.3 Suggestions on Industry Investment Strategy


    List of Tables and Figures

    • Figure China Semiconductor Assembly and Packaging Equipment Industry Market Size (2018-2029)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume, Production Value and Growth Rate of Packaging Equipment (2018-2029)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume, Production Value and Growth Rate of Wire Bonders (2018-2029)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume, Production Value and Growth Rate of Others (2018-2029)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume, Production Value and Growth Rate of Die Bonders (2018-2029)

    • Figure China Semiconductor Assembly and Packaging Equipment Sales Volume, Sales Value and Growth Rate of IDMs (2018-2029)

    • Figure China Semiconductor Assembly and Packaging Equipment Sales Volume, Sales Value and Growth Rate of OSAT (2018-2029)

    • Figure North China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

    • Figure Central China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

    • Figure South China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

    • Figure East China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

    • Figure Northeast China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

    • Figure Southwest China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

    • Figure Northwest China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate from 2018-2029

    • Figure Semiconductor Assembly and Packaging Equipment Industry Chain

    • Table Product Types of Major Suppliers in 2023

    • Figure China Semiconductor Assembly and Packaging Equipment Market Share by Type in 2018

    • Figure China Semiconductor Assembly and Packaging Equipment Market Share by Type in 2023

    • Figure China Semiconductor Assembly and Packaging Equipment Total Production Volume and Growth Rate from Production Side (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate of Packaging Equipment (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate of Wire Bonders (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate of Others (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume and Growth Rate of Die Bonders (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Market Share by Application in 2018

    • Figure China Semiconductor Assembly and Packaging Equipment Market Share by Application in 2023

    • Figure China Semiconductor Assembly and Packaging Equipment Total Market Size and Growth Rate from Consumption End

    • Figure China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate of IDMs (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Market Size and Growth Rate of OSAT (2018-2023)

    • Table China Semiconductor Assembly and Packaging Equipment Production Volume by Region (2018-2023)

    • Table China Semiconductor Assembly and Packaging Equipment Production Volume Share by Region (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Volume Share by Region (2018-2023)

    • Table China Semiconductor Assembly and Packaging Equipment Production Value by Region (2018-2023)

    • Table China Semiconductor Assembly and Packaging Equipment Production Value Share by Region (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Production Value Share by Region (2018-2023)

    • Table China Semiconductor Assembly and Packaging Equipment Sales Volume by Region (2018-2023)

    • Table China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Region (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Region (2018-2023)

    • Table China Semiconductor Assembly and Packaging Equipment Sales Value by Region (2018-2023)

    • Table China Semiconductor Assembly and Packaging Equipment Sales Value Share by Region (2018-2023)

    • Figure China Semiconductor Assembly and Packaging Equipment Sales Value Share by Region (2018-2023)

    • Table North China Semiconductor Assembly and Packaging Equipment Production Volume by Type (2018-2023)

    • Table North China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Figure North China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Table North China Semiconductor Assembly and Packaging Equipment Sales Volume by Application (2018-2023)

    • Table North China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Figure North China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Table Central China Semiconductor Assembly and Packaging Equipment Production Volume by Type (2018-2023)

    • Table Central China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Figure Central China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Table Central China Semiconductor Assembly and Packaging Equipment Sales Volume by Application (2018-2023)

    • Table Central China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Figure Central China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Table South China Semiconductor Assembly and Packaging Equipment Production Volume by Type (2018-2023)

    • Table South China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Figure South China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Table South China Semiconductor Assembly and Packaging Equipment Sales Volume by Application (2018-2023)

    • Table South China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Figure South China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Table East China Semiconductor Assembly and Packaging Equipment Production Volume by Type (2018-2023)

    • Table East China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Figure East China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Table East China Semiconductor Assembly and Packaging Equipment Sales Volume by Application (2018-2023)

    • Table East China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Figure East China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Table Northeast China Semiconductor Assembly and Packaging Equipment Production Volume by Type (2018-2023)

    • Table Northeast China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Figure Northeast China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Table Northeast China Semiconductor Assembly and Packaging Equipment Sales Volume by Application (2018-2023)

    • Table Northeast China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Figure Northeast China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Table Southwest China Semiconductor Assembly and Packaging Equipment Production Volume by Type (2018-2023)

    • Table Southwest China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Figure Southwest China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Table Southwest China Semiconductor Assembly and Packaging Equipment Sales Volume by Application (2018-2023)

    • Table Southwest China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Figure Southwest China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Table Northwest China Semiconductor Assembly and Packaging Equipment Production Volume by Type (2018-2023)

    • Table Northwest China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Figure Northwest China Semiconductor Assembly and Packaging Equipment Production Volume Share by Type (2018-2023)

    • Table Northwest China Semiconductor Assembly and Packaging Equipment Sales Volume by Application (2018-2023)

    • Table Northwest China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Figure Northwest China Semiconductor Assembly and Packaging Equipment Sales Volume Share by Application (2018-2023)

    • Table DIAS Automation Company Profile

    • Table DIAS Automation Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)

    • Table Shinkawa Company Profile

    • Table Shinkawa Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)

    • Table Toray Engineering Company Profile

    • Table Toray Engineering Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)

    • Table West Bond Company Profile

    • Table West Bond Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)

    • Table Hesse Mechatronics Company Profile

    • Table Hesse Mechatronics Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)

    • Table Kulicke & Soffa Industries Company Profile

    • Table Kulicke & Soffa Industries Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)

    • Table HYBOND Company Profile

    • Table HYBOND Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)

    • Table Accrutech Company Profile

    • Table Accrutech Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)

    • Table Palomar Technologies Company Profile

    • Table Palomar Technologies Semiconductor Assembly and Packaging Equipment Revenue, Price and Gross (2018-2023)


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