Global CMP Slurry Market Size was $1844.29 million in 2023

Global CMP Slurry Market Overview

According to Global Market Monitor, the global CMP slurry market size was $1844.29 million in 2023 with a CAGR of 8.46% from 2023 to 2029. Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals, and used in CMP processes for semiconductors.

Market Drivers

The growing demand for semiconductors and memory chips in markets, including the Internet of Things (IoT), automotive, and 5G, is expected to drive the demand for CMP slurries during the forecast period. The growing adoption of electric and autonomous vehicles creates a huge demand for semiconductors and ICs, projected to drive the market for CMP slurry.

Market Limitations

Aluminum oxide is the most adopted slurry material in the market.    CMP processes for advanced logic and memory devices require more varied, non-metal layer combinations that need highly tunable and dilatable CMP slurries to achieve both technical and economic objectives.    However, high investment and R&D costs, along with frequent changes in process, are some of the major factors restraining the market growth.

Global CMP Slurry Market Size

Fierce Competition

The CMP slurry market is witnessing significant competition. Major semiconductor industry player depends on their affiliates for the CMP slurry process. Overall, the intensity of the competitive rivalry in the market studied is growing and expected to grow moderately in the forecast period owing to the growth of the semiconductor and IC chip industry. Cabot Microelectronics, Dupont De Nemours Inc., Fujifilm Corporation, Merck KGaA, etc., are some of the major players in the market. 
Market News

Fujifilm Holdings invest JPY 110 million to increase the production of a chip-polishing material in Taiwan, in line with the rising semiconductor demand from self-driving vehicles and 5G communication technologies.   The company built a new plant and expanded existing facilities owned by subsidiary Fujifilm Electronic Materials Taiwan to increase its production capacity of CMP slurry, a material used to polish and planarize the surface of chips, by 50%. It also planned to begin production of CMP slurry at a plant in southern Japan's Kumamoto prefecture in 2024, introducing state-of-the-art equipment for producing CMP pastes, a key material used in semiconductor manufacturing. Fujifilm's first CMP pulp production facility in Japan is scheduled to begin construction in April 2023 and become operational in January 2024.

Company Name

Fujifilm

Website

www.fujimico.com

Established Time

1934

Plant Locations

Mainly in North America, Asia Pacific

Market Distribution

Worldwide


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