Reflow soldering refers to a soldering technique that uses solder paste to connect electronic components to contact pads, melts the solder by controlling heating, and achieves permanent bonding. 

Reflow soldering system is mainly used to solder electronic components onto PCB boards, and it is a key link in SMT (Surface Mount Technology) process. The reflow soldering system mainly includes two parts: a conveying device and a heating device. The conveying device is responsible for conveying the PCB board to the heating device, while the heating device is responsible for melting the solder and soldering the electronic components to the PCB board.

Overview of Market Development

The global reflow soldering system market has shown a steady increase in recent years. According to our research data, the global reflow soldering system market revenue is estimated to be $1132 million in 2024, an increase of 5.08% compared to 2023.

From the perspective of market trends, the global reflow soldering system market will continue to maintain stable growth in the coming years. On the one hand, as electronic products continue to develop towards slimness and miniaturization, the application scope of reflow soldering systems will become increasingly wide; On the other hand, with the continuous upgrading of the manufacturing industry, enterprises have increasingly high requirements for the performance and stability of reflow soldering systems, which will promote the continuous technological upgrading and innovation of reflow soldering systems. It is expected that by 2029, the global reflow soldering system will increase to $1507 million. The CAGR for 2024-2029 is estimated to be 5.89%.

Segmented Market Analysis

From the perspective of product types, according to different reflow methods, reflow soldering systems can be divided into two categories: convection reflow soldering systems and condensation reflow soldering systems. Among them, the convection reflow soldering system dominates the market. According to the data, the estimated revenue for the global convection reflow soldering system segment in 2024 is $731 million, and the market share is expected to reach 64.54%.

From the perspective of downstream application patterns, reflow soldering systems are mainly used in consumer electronics, automotive electronics, and communication fields. Among them, the consumer electronics field is the largest downstream application market for reflow soldering systems, with an estimated application share of 43.95% in 2024.

Source: www.globalmarketmonitor.com

Analysis of Market Development in Major Regions

From a regional perspective, the global reflow soldering system market is dominated by three major regions: North America, Europe, and Asia Pacific. Among them, the Asia Pacific region is the largest revenue market. Data shows that the estimated revenue of the reflow soldering system market in the Asia Pacific region in 2024 is $517 million, and its share in the global total revenue is expected to reach 46.26%; The North American and European markets are expected to rank second and third with market shares of 25.34% and 20.82%, respectively.

Regions	Market Revenue (Million USD)	Market Share
North America	289	25.34%
Europe	239	20.82%
Asia Pacific	517	46.26%
Central & South America	45	3.94%
Middle East & Africa	42	3.64%