Electronic packaging refers to the general term for containers, materials, and auxiliary materials used in the circulation of electronic products according to certain technical methods to protect the products, facilitate storage and transportation, and promote sales. It not only provides protection at the physical level, but also offers convenience during product sales, storage, and transportation.

Overview of Market Development

The global electronic packaging market is in a stage of rapid development. According to our research data, the estimated global electronic packaging market size in 2024 is $44.97 billion, an increase of 8.95% compared to 2023.

In the future, it is expected that the market will maintain strong growth momentum. By 2029, the global electronic packaging market is expected to continue to grow to $71.28 billion. The CAGR for 2024-2029 is estimated to be 9.65%. From the perspective of development trends, electronic packaging technology will place greater emphasis on safety, energy efficiency, and human-computer interaction. New packaging technologies, materials, and designs will continue to emerge to meet the higher-level requirements of electronic products

Analysis of Market Competition Pattern

From the perspective of market competition, the concentration of the global electronic packaging market is moderate. According to data, the total revenue share of the electronic packaging market for the top 3 companies in the industry in 2023 is 40.63%. The top three companies were YASE Technology Holding, Co., Ltd., Amkor Technology, Inc., and Jcet group. In 2023, these three companies accounted for 16.59%, 12.04%, and 12.01% of the global electronic packaging market revenue, respectively.

Source: www.globalmarketmonitor.com

Segmented Market Analysis

From the perspective of product types, the mainstream products in the global electronic packaging market currently include organic substrates, bonding wires, and ceramic packaging. Among them, the organic substrate sub category dominates the market, with an estimated market share of 59.39% in 2024.

From the perspective of downstream application patterns, electronic packaging is mainly used in fields such as semiconductors & integrated circuits (IC) and printed circuit boards (PCBs). Among them, the semiconductor & IC field holds the highest share, estimated at 51.90% in 2024.

	Market Size (Billion USD)	Market Share
Segmented by Type
Organic Substrates	26.70	59.39%
Bonding Wires	4.71	10.47%
Ceramic Packaging	10.83	24.09%
Others	2.72	6.06%
Segmented by Application
Semiconductor & IC	23.34	51.90%
PCBs	19.22	42.74%
Others	2.41	5.36%