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The Growth of the Plating for Microelectronics Market is Largely Driven by Downstream Consumption

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin layer of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel which impart wear and corrosion resistance, improve strength. Precious metal coatings are especially important to the electronics and semiconductor industries. Electronic electroplating is the electroplating process used in the manufacture of electronic products. It is an important link in the manufacturing and processing of electronic products and reflects the technological level of the electronic manufacturing industry to a large extent. Due to the special requirements of electronic products, electronic electroplating is different from traditional electroplating. Electronic plating technology is an indispensable key technique in modern micro-electronic manufacturing. Further, since the electronic plating is facing the high-tech content of the electronic field compared with conventional decoration, protective electroplating, there are different aspects, functions, accuracy, quality and electroplating methods, and the technical requirements are very high. One sense of electron plating has become a specialized technology independent of conventional plating.

Plating can be divided as electroplating, electroless and immersion. In 2017, these three types respectively covered a market share of 43.31%，35.22% and 21.47%. Electroplating had a larger market while the others also covered a certain market share. Gold, zinc, nickel, bronze, tin, copper can be applied in plating, and respectively covered a market share of 10.13%，15.01%，17.91%，10.90%,15.23%，21.31% in 2017.

Companies of Plating for microelectronics are mainly from United States and Japan; the industry concentrate rate is high. The top three companies are Atotech, DOW, Mitsubishi Materials Corporation, with the revenue market share of 18.92%, 8.61%, and 8.02% in 2017. The top 5 companies altogether covered a market share of 49.28% in 2017 while that of top 10 companies was 70.36%.

North America was the largest revenue market with a market share of 31.18% in 2013 and 27.88% in 2018 with an increase of -3.30%. Asia Pacific ranked the second market with the market share of 28.22% in 2017. Japan and China are the main markets of Asia Pacific with a market value of 156.58M USD and 138.57M USD in 2017. As the third largest market, Europe covered a market share of 26.91% in 2017. Also, the Southeast Asia, Middle East, South America markets for plating for microelectronics are expected to be the market with the most promising growth rate. Development of economy, consumer electronics industry, automobile industry, medical service industry, technology innovation progress in emerging economies such as India, Philippines, Thailand, Brazil, Saudi Araba and Vietnam has led to an increase in demand.

The growth of the Plating for microelectronics market is largely driven by downstream consumptions. With the development of economy, demanding for the more consumer electronics, automobiles, medical equipment, which promote this industry to develop. What is more, manufacturers keep on updating their technology and keep on product innovation, which increased the penetration of more productive and cost-effective, and high-performance products and services.

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Global Plating for Microelectronics Market Forecast

According to our research, the global plating for microelectronics market has a total production value of 1289.17 M USD back in 2013, and increased to 1645.02 M USD in 2018. We made a series of functional calculation and deduced the data of past 5 years with scientific model. Finally, we made the prediction that the value of Plating for microelectronics markets can be 2086.14 M USD by 2023. The CAGR of Plating for microelectronics is 4.91% from 2017 to 2023.

With the support of governmental policy, the rapid development of the economy and the continuous improvement of science and technology, the Asia-Pacific region is expected to become the largest revenue market, and the market value will reach 669.23 M USD by 2023, and the market share will increase to 32.08%. North America will become the second largest market with a market share of 25.76%. Europe follows and the market share is expected to be 22.43% by 2023.

The growth of the Plating for microelectronics market is largely driven by downstream consumptions. With the development of economy, demanding for the more consumer electronics, automobiles, medical equipment, which promote this industry to develop. What is more, manufacturers keep on updating their technology and keep on product innovation, which increased the penetration of more productive and cost-effective, and high-performance products and services. In the next few years, the global microelectronics plating market will develop well, and the mature markets and emerging markets will develop stable.

However, due to the special nature of this industry, high raw materials and lack of innovation may hinder market growth. Although many countries and regions have given the industry policy and financial support, such as China, which builds good development environment for companies and the domestic potential consumption market is huge, which is conducive to the development of this industry. However, the development of different regions and the policies and fund subsidies are various, enterprises should formulate the right development strategy clear development direction according to their own situation and accelerate the process of technology and product innovation, enhance corporate competition, and win more markets share. New enterprises need to take full consideration, because the concentration rate of this industry is high, most customers are monopolized by large companies. Besides, there are high production costs, high technology levels and equipment requirements, it is difficult to win a place in a fierce market competition without sufficient funds and technical support, as well as stable customer markets.

Get the complete sample, please click: https://www.globalmarketmonitor.com/reports/762856-plating-for-microelectronics-market-report.html